Electronic device including antenna module

ABSTRACT

An electronic device includes a housing that includes a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the back plate and at least a portion of which is formed of a metal material. A display is viewable through the front plate, and an antenna module is positioned in the space and includes a first surface facing a third direction different from the first direction and the second direction, a second surface facing a fourth direction different from the third direction, and at least one conductive element extended in a fifth direction, which is perpendicular to the third direction and the fourth direction and faces a first portion of the side member, adjacent to the side member, and between the first surface and the second surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/591,552 filed on Oct. 2, 2019, which is based on and claims priorityunder 35 U.S.C. § 119 to Korean Patent Application No. 10-2018-0117623filed on Oct. 2, 2018, in the Korean Intellectual Property Office, thedisclosures of which are herein incorporated by reference in theirentirety.

BACKGROUND 1. Field

The disclosure relates to an electronic device including an antennamodule.

2. Description of Related Art

Because an antenna operates at a relatively low frequency (e.g., 3 GHzor less), the antenna uses a metal material of a housing of anelectronic device as a radiator. However, this manner fails to beapplied to an antenna that operates at a high frequency (e.g., 6 GHz ormore) having the strong straightness. The antenna that operates at arelatively high frequency may be mounted inside an electronic device asa separate module.

When radio waves are emitted, the antenna module may have an influenceof a material of the housing forming the exterior of the electronicdevice. In particular, in recent mobile electronic devices, a portion ofthe housing is formed of a metal material.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

In the case of the electronic device including the housing of a metalmaterial, a radio frequency (RF) signal that is radiated from an antennamodule may have an influence of the metal material of the housing.

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providean electronic device including an antenna module layout structure.

In accordance with an aspect of the disclosure, an electronic device mayinclude a housing that includes a front plate facing a first direction,a back plate facing a second direction opposite to the first direction,and a side member surrounding a space between the front plate and theback plate and at least a portion of which is formed of a metalmaterial, a display that is viewable through the front plate, and anantenna module that is positioned in the space and includes a firstsurface facing a third direction different from the first direction andthe second direction, a second surface facing a fourth directiondifferent from the third direction, and at least one conductive elementextended in a fifth direction facing a first portion of the side member.The at least one conductive element may be adjacent to the side memberand is between the first surface and the second surface, and the fifthdirection may be perpendicular to the third direction and the fourthdirection. The first surface may include a first periphery the closestfrom the first portion of the side member, and a second periphery themost distant from the first portion of the side member, and the firstsurface may make an angle between 1 degree to 15 degrees with the backplate such that the first periphery is closer to the back plate than thesecond periphery.

In accordance with another aspect of the disclosure, an electronicdevice may include a housing that includes a front plate facing a firstdirection, a back plate including a flat portion facing a seconddirection opposite to the first direction and a curved portionsurrounding the flat portion, and a side member surrounding a spacebetween the front plate and the back plate and at least a portion ofwhich is formed of a metal material, a display that is viewable throughthe front plate, and an antenna module that is positioned in the spaceand includes a first surface facing a third direction different from thefirst direction and the second direction, a second surface facing afourth direction different from the third direction, and at least one ormore conductive elements extended in a fifth direction facing a firstportion of the side member. The at least one conductive elements may beadjacent to the side member and is between the first surface and thesecond surface, and the fifth direction may be perpendicular to thethird direction and the fourth direction. The first surface may includea first periphery the closest from the first portion of the side memberand a second periphery the most distant from the first portion of theside member, and the first periphery may be disposed to be closer to theback plate than the second periphery.

In accordance with another aspect of the disclosure, an electronicdevice may include a housing structure that includes a first coverforming a first surface of the electronic device, a second cover forminga second surface of the electronic device, which is opposite to thefirst surface, and a side member surrounding a space between the firstcover and the second cover and forming a third surface of the electronicdevice, a display that is interposed between the first cover and thesecond cover, and an antenna module that is interposed between thedisplay and the second cover, and including a first surface including afirst radiation region where a first RF signal is radiated, a secondsurface opposite to the first surface, a third surface formed betweenthe first surface and the second surface and including a secondradiation region where a second RF signal is radiated, and a fourthsurface formed between the first surface and the second surface andopposite to the third surface. The antenna module may be disposed to beinclined at a given angle with respect to the second cover such that thefirst surface faces the second cover, the third surface is more adjacentto the side member than the fourth surface, and at least a portion ofthe second radiation region faces the second cover.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

Before undertaking the DETAILED DESCRIPTION below, it may beadvantageous to set forth definitions of certain words and phrases usedthroughout this patent document: the terms “include” and “comprise,” aswell as derivatives thereof, mean inclusion without limitation; the term“or,” is inclusive, meaning and/or; the phrases “associated with” and“associated therewith,” as well as derivatives thereof, may mean toinclude, be included within, interconnect with, contain, be containedwithin, connect to or with, couple to or with, be communicable with,cooperate with, interleave, juxtapose, be proximate to, be bound to orwith, have, have a property of, or the like; and the term “controller”means any device, system or part thereof that controls at least oneoperation, such a device may be implemented in hardware, firmware orsoftware, or some combination of at least two of the same. It should benoted that the functionality associated with any particular controllermay be centralized or distributed, whether locally or remotely.

Moreover, various functions described below can be implemented orsupported by one or more computer programs, each of which is formed fromcomputer readable program code and embodied in a computer readablemedium. The terms “application” and “program” refer to one or morecomputer programs, software components, sets of instructions,procedures, functions, objects, classes, instances, related data, or aportion thereof adapted for implementation in a suitable computerreadable program code. The phrase “computer readable program code”includes any type of computer code, including source code, object code,and executable code. The phrase “computer readable medium” includes anytype of medium capable of being accessed by a computer, such as readonly memory (ROM), random access memory (RAM), a hard disk drive, acompact disc (CD), a digital video disc (DVD), or any other type ofmemory. A “non-transitory” computer readable medium excludes wired,wireless, optical, or other communication links that transporttransitory electrical or other signals. A non-transitory computerreadable medium includes media where data can be permanently stored andmedia where data can be stored and later overwritten, such as arewritable optical disc or an erasable memory device.

Definitions for certain words and phrases are provided throughout thispatent document, those of ordinary skill in the art should understandthat in many, if not most instances, such definitions apply to prior, aswell as future uses of such defined words and phrases.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and itsadvantages, reference is now made to the following description taken inconjunction with the accompanying drawings, in which like referencenumerals represent like parts:

FIG. 1 illustrates a front perspective view of a mobile electronicdevice according to an embodiment;

FIG. 2 illustrates a back perspective view of an electronic device ofFIG. 1;

FIG. 3 illustrates an exploded perspective view of an electronic deviceof FIG. 1;

FIG. 4 illustrates a block diagram of an electronic device in a networkenvironment, in various embodiments;

FIG. 5 illustrates a block diagram of an electronic device forsupporting legacy network communication and 5G network communication, invarious embodiments;

FIGS. 6A-6C illustrate an example of a structure of a third antennamodule described with reference to FIG. 5, according to variousembodiments;

FIG. 7 illustrates a cross-sectional view of a third antenna moduletaken along a line B-B′ of FIG. 6A, according to various embodiments;

FIG. 8A illustrates an exploded perspective view of an electronic deviceaccording to an embodiment;

FIG. 8B illustrates a side view of a portion of an electronic deviceaccording to an embodiment;

FIG. 9A illustrates a perspective view of an antenna module of anelectronic device according to an embodiment;

FIG. 9B illustrates a perspective view of an antenna substrate of anantenna module of an electronic device according to an embodiment;

FIG. 10 illustrates a view of a layout of an antenna module of anelectronic device according to an embodiment;

FIG. 11 illustrates a view of a layout of a first antenna module of anelectronic device according to an embodiment;

FIG. 12A illustrates a view of a first antenna module of an electronicdevice and a rear case where a first antenna module is disposed,according to an embodiment;

FIG. 12B illustrates an exploded perspective view of a first antennamodule and a rear case, according to an embodiment;

FIG. 12C illustrates a cross-sectional view of a rear case where a firstantenna module is disposed, according to an embodiment;

FIG. 13A illustrates a cross-sectional view of an electronic devicewhere a second antenna module is disposed, according to an embodiment;and

FIG. 13B illustrates a cross-sectional view of an electronic devicewhere a third antenna module is disposed, according to an embodiment.

DETAILED DESCRIPTION

FIGS. 1 through 13B, discussed below, and the various embodiments usedto describe the principles of the present disclosure in this patentdocument are by way of illustration only and should not be construed inany way to limit the scope of the disclosure. Those skilled in the artwill understand that the principles of the present disclosure may beimplemented in any suitably arranged system or device.

Hereinafter, various embodiments of the disclosure will be describedwith reference to accompanying drawings. However, those of ordinaryskill in the art will recognize that modification, equivalent, and/oralternative on various embodiments described herein can be variouslymade without departing from the scope and spirit of the disclosure.

Referring to FIGS. 1 and 2, an electronic device 100 according to anembodiment may include a housing 110 including a first surface (or afront surface) 110A, a second surface (or a back surface) 110B, and aside surface 110C surrounding a space between the first surface 110A andthe second surface 110B. In another embodiment (not illustrated), ahousing may refer to a structure that forms a part of the first surface110A, the second surface 110B, and the side surface 110C of FIG. 1.According to an embodiment, the first surface 110A may be implementedwith a front plate 102 (e.g., a glass plate including various coatinglayers, or a polymer plate), at least a portion of which issubstantially transparent. The second surface 110B may be implementedwith a back plate 111 that is substantially opaque. For example, theback plate 111 may be implemented with a coated or colored glass, aceramic, a polymer, a metal (e.g., aluminum, stainless steel (STS), ormagnesium), or a combination of at least two of the materials. The sidesurface 110C may be coupled with the front plate 102 or the back plate111 and may be implemented with a side bezel structure (or a “sidemember”) 118 including a metal and/or a polymer. In an embodiment, theback plate 111 and the side bezel structure 118 may be integrally formedand may include the same material (e.g., a metal material such asaluminum).

In the embodiment illustrated, the front plate 102 may include two firstregions 110D, which are bent toward the back plate 111 from the firstsurface 110A so as to be seamlessly extended, at opposite long edges ofthe front plate 102. In the embodiment (refer to FIG. 2) illustrated,the back plate 111 may include two second regions 110E, which are benttoward the front plate 102 from the second surface 110B so as to beseamlessly extended, at opposite long edges thereof. In an embodiment,the front plate 102 (or the back plate 111) may include only one of thefirst regions 110D (or the second regions 110E). In another embodiment,a part of the first regions 110D or the second regions 110E may not beincluded. In the embodiments, when viewed from a side surface of theelectronic device 100, the side bezel structure 118 may have a firstthickness (or width) on one side where the first regions 110D or thesecond regions 110E are not included, and may have a second thickness,which is smaller than the first thickness, on one side where the firstregions 110D or the second regions 110E are included.

According to an embodiment, the electronic device 100 may include atleast one or more of a display 101, an audio module (103, 107, 114), asensor module (104, 116, 119), a camera module (105, 112, 113), keyinput devices 117, a light-emitting device 106, and a connector hole(108, 109). In an embodiment, the electronic device 100 may not includeat least one (e.g., the key input devices 117 or the light-emittingdevice 106) of the components or may further include any othercomponent.

The display 101 may be exposed through a considerable portion of thefront plate 102, for example. In an embodiment, at least a portion ofthe display 101 may be exposed through the first surface 110A and thefront plate 102 forming the first regions 110D of the side surface 110C.In an embodiment, a corner of the display 101 may be formed to be mostlyidentical to a shape of an outer portion of the front plate 102 adjacentthereto. In another embodiment (not illustrated), to increase the areawhere the display 101 is exposed, a distance between an outer portion ofthe display 101 and an outer portion of the front plate 102 may beformed mostly identically.

In another embodiment (not illustrated), a recess or an opening may beformed at a portion of a screen display region of the display 101, andat least one or more of the audio module 114, the sensor module 104, thecamera module 105, and the light-emitting device 106 may be provided tobe aligned with the recess or the opening. In another embodiment (notillustrated), a recess or at least one or more of the audio module 114,the sensor module 104, the camera module 105, the fingerprint sensor116, and the light-emitting device 106 may be provided on a back surfaceof the screen display region of the display 101. In another embodiment(not illustrated), the display 101 may be coupled with a touch sensingcircuit, a pressure sensor capable of measuring the intensity (orpressure) of a touch, and/or a digitizer capable of detecting a magneticstylus pen or may be positioned adjacent thereto. In an embodiment, atleast a part of the sensor module (104, 119) and/or at least a part ofthe key input devices 117 may be disposed in the first regions 110Dand/or the second regions 110E.

The audio module (103, 107, 114) may include a microphone hole 103 andspeaker holes 107 and 114. A microphone for obtaining an external soundmay be positioned in the microphone hole 103; in an embodiment, aplurality of microphones may be positioned to make it possible to detecta direction of sound. The speaker holes 107 and 114 may include anexternal speaker hole 107 and a receiver hole 114 for call. In anembodiment, the speaker holes 107 and 114 and the microphone hole 103may be implemented with one hole, or a speaker (e.g., a piezoelectricspeaker) may be included without the speaker holes 107 and 114.

The sensor module (104, 116, 119) may generate an electrical signal or adata value corresponding to an internal operation state of theelectronic device 100 or corresponding to an external environment state.The sensor module (104, 116, 119) may include, for example, the firstsensor module 104 (e.g., a proximity sensor) and/or a second sensormodule (not illustrated) (e.g., a fingerprint sensor) disposed on thefirst surface 110A of the housing 110, and/or the third sensor module119 (e.g., a hear rate monitor (HRM) sensor) and/or the fourth sensormodule 116 (e.g., a fingerprint sensor) disposed on the second surface110B of the housing 110. The fingerprint sensor may be disposed on thesecond surface 110B as well as the first surface 110A (e.g., the display101) of the housing 110. The electronic device 100 may further include asensor module not illustrated, for example, at least one of a gesturesensor, a grip sensor, a barometric pressure sensor, a magnetic sensor,an acceleration sensor, a grip sensor, a color sensor, an infrared (IR)sensor, a biometric sensor, a temperature sensor, a humidity sensor, orthe illumination sensor 104.

The camera module (105, 112, 113) may include the first camera device105 disposed on the first surface 110A of the electronic device 100, andthe second camera device 112 and/or the flash 113 disposed on the secondsurface 110B. The camera devices 105 and 112 may include one or morelenses, an image sensor, and/or an image signal processor. The flash 113may include, for example, a light emitting diode or a xenon lamp. In anembodiment, two or more lenses (e.g., an infrared camera and wide-angleand telephoto lenses) and image sensors may be disposed on one surfaceof the electronic device 100.

The key input devices 117 may be disposed on the side surface 110C ofthe housing 110. In another embodiment, the electronic device 100 maynot include all or a part of the key input devices 117, and the keyinput device not included may be implemented on the display 101 in theform of a soft key. In an embodiment, a key input device may include thesensor module 116 disposed on the second surface 110B of the housing110.

The light-emitting device 106 may be disposed, for example, on the firstsurface 110A of the housing 110. The light-emitting device 106 mayprovide state information of the electronic device 100, for example, inthe form of light. In another embodiment, the light-emitting device 106may provide, for example, a light source that operates in conjunctionwith an operation of the camera module 105. The light-emitting device106 may include, for example, a light-emitting diode (LED), an infrared(IR) LED, and a xenon lamp.

The connector hole (108, 109) may include the first connector hole 108that may accommodate a connector (e.g., a universal serial bus (USB)connector) for transmitting/receiving a power and/or data to/from anexternal electronic device, and/or the second connector hole (or anearphone jack) 109 that may accommodate a connector fortransmitting/receiving an audio signal to/from the external electronicdevice.

Referring to FIG. 3, the electronic device 100 may include a side bezelstructure 140, a first support member 142 (e.g., a bracket), a frontplate 120, a display 130, a printed circuit board 150, a battery 152, asecond support member 160 (e.g., a rear case), an antenna 170, and aback plate 180. In an embodiment, the electronic device 100 may notinclude at least one (e.g., the first support member 142 or the secondsupport member 160) of the components or may further include any othercomponent. At least one of the components of the electronic device 100may be identical or similar to at least one of the components of theelectronic device 100 of FIG. 1 or 2, and thus, additional descriptionwill be omitted to avoid redundancy.

The first support member 142 may be positioned in the electronic device100, and may be connected with the side bezel structure 140 or may beintegrally formed with the side bezel structure 140. The first supportmember 142 may be formed of, for example, a metal material and/or anonmetal material (e.g., a polymer). The display 130 may be coupled withone surface of the first support member 142, and the printed circuitboard 150 may be coupled with an opposite surface of the display 130. Aprocessor, a memory, and/or an interface may be mounted on the printedcircuit board 150. For example, the processor may include one or more ofa central processing unit, an application processor, a graphicprocessing device, an image signal processor, a sensor hub processor, ora communication processor.

The memory may include, for example, a volatile memory or a nonvolatilememory.

The interface may include, for example, a high definition multimediainterface (HDMI), a USB interface, a secure digital (SD) card interface,and/or an audio interface. The interface may electrically or physicallyconnect, for example, the electronic device 100 with an externalelectronic device and may include a USB connector, an SD card/MMCconnector, or an audio connector.

The battery 152 that is a device for supplying a power to at least onecomponent of the electronic device 100 may include, for example, aprimary cell incapable of being recharged, a secondary cellrechargeable, or a fuel cell. At least a portion of the battery 152 maybe disposed on substantially the same plane as the printed circuit board150, for example. The battery 152 may be integrally disposed in theelectronic device 100, or may be disposed to be removable from theelectronic device 100.

The antenna 170 may be interposed between the back plate 180 and thebattery 152. The antenna 170 may include, for example, a near fieldcommunication (NFC) antenna, an antenna for wireless charging, and/or amagnetic secure transmission (MST) antenna. For example, the antenna 170may perform short range communication with an external device or maywirelessly transmit/receive a power necessary to charge. In anotherembodiment, an antenna structure may be implemented with a part of theside bezel structure 140 and/or the first support member 142, or with acombination thereof.

FIG. 4 illustrates a block diagram of an electronic device 401 in anetwork environment 400 according to various embodiments. Referring toFIG. 4, the electronic device 401 in the network environment 400 maycommunicate with an electronic device 402 via a first network 498 (e.g.,a short-range wireless communication network), or an electronic device404 or a server 408 via a second network 499 (e.g., a long-rangewireless communication network). According to an embodiment, theelectronic device 401 may communicate with the electronic device 404 viathe server 408. According to an embodiment, the electronic device 401may include a processor 420, memory 430, an input device 450, a soundoutput device 455, a display device 460, an audio module 470, a sensormodule 476, an interface 477, a haptic module 479, a camera module 480,a power management module 488, a battery 489, a communication module490, a subscriber identification module(SIM) 496, or an antenna module497. In some embodiments, at least one (e.g., the display device 460 orthe camera module 480) of the components may be omitted from theelectronic device 401, or one or more other components may be added inthe electronic device 401. In some embodiments, some of the componentsmay be implemented as single integrated circuitry. For example, thesensor module 476 (e.g., a fingerprint sensor, an iris sensor, or anilluminance sensor) may be implemented as embedded in the display device460 (e.g., a display).

The processor 420 may execute, for example, software (e.g., a program440) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 401 coupled with theprocessor 420, and may perform various data processing or computation.According to one embodiment, as at least part of the data processing orcomputation, the processor 420 may load a command or data received fromanother component (e.g., the sensor module 476 or the communicationmodule 490) in volatile memory 432, process the command or the datastored in the volatile memory 432, and store resulting data innon-volatile memory 434. According to an embodiment, the processor 420may include a main processor 421 (e.g., a central processing unit (CPU)or an application processor (AP)), and an auxiliary processor 423 (e.g.,a graphics processing unit (GPU), an image signal processor (ISP), asensor hub processor, or a communication processor (CP)) that isoperable independently from, or in conjunction with, the main processor421. Additionally or alternatively, the auxiliary processor 423 may beadapted to consume less power than the main processor 421, or to bespecific to a specified function. The auxiliary processor 423 may beimplemented as separate from, or as part of the main processor 421.

The auxiliary processor 423 may control at least some of functions orstates related to at least one component (e.g., the display device 460,the sensor module 476, or the communication module 490) among thecomponents of the electronic device 401, instead of the main processor421 while the main processor 421 is in an inactive (e.g., sleep) state,or together with the main processor 421 while the main processor 421 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 423 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 480 or the communication module 490)functionally related to the auxiliary processor 423.

The memory 430 may store various data used by at least one component(e.g., the processor 420 or the sensor module 476) of the electronicdevice 401. The various data may include, for example, software (e.g.,the program 440) and input data or output data for a command relatedthereto. The memory 430 may include the volatile memory 432 or thenon-volatile memory 434.

The program 440 may be stored in the memory 430 as software, and mayinclude, for example, an operating system (OS) 442, middleware 444, oran application 446.

The input device 450 may receive a command or data to be used by othercomponent (e.g., the processor 420) of the electronic device 401, fromthe outside (e.g., a user) of the electronic device 401. The inputdevice 450 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 455 may output sound signals to the outside ofthe electronic device 401. The sound output device 455 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for an incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display device 460 may visually provide information to the outside(e.g., a user) of the electronic device 401. The display device 460 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaydevice 460 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 470 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 470 may obtainthe sound via the input device 450, or output the sound via the soundoutput device 455 or a headphone of an external electronic device (e.g.,an electronic device 402) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 401.

The sensor module 476 may detect an operational state (e.g., power ortemperature) of the electronic device 401 or an environmental state(e.g., a state of a user) external to the electronic device 401, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 476 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 477 may support one or more specified protocols to be usedfor the electronic device 401 to be coupled with the external electronicdevice (e.g., the electronic device 402) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 477 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 478 may include a connector via which theelectronic device 401 may be physically connected with the externalelectronic device (e.g., the electronic device 402). According to anembodiment, the connecting terminal 478 may include, for example, a HDMIconnector, a USB connector, a SD card connector, or an audio connector(e.g., a headphone connector).

The haptic module 479 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 479 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 480 may capture a still image or moving images.According to an embodiment, the camera module 480 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 488 may manage power supplied to theelectronic device 401. According to one embodiment, the power managementmodule 488 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 489 may supply power to at least one component of theelectronic device 401. According to an embodiment, the battery 489 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 490 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 401 and the external electronic device (e.g., theelectronic device 402, the electronic device 404, or the server 408) andperforming communication via the established communication channel. Thecommunication module 490 may include one or more communicationprocessors that are operable independently from the processor 420 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 490 may include a wireless communication module492 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 494 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network498 (e.g., a short-range communication network, such as Bluetoot™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 499 (e.g., a long-range communication network,such as a cellular network, the Internet, or a computer network (e.g.,LAN or wide area network (WAN)). These various types of communicationmodules may be implemented as a single component (e.g., a single chip),or may be implemented as multi components (e.g., multi chips) separatefrom each other. The wireless communication module 492 may identify andauthenticate the electronic device 401 in a communication network, suchas the first network 498 or the second network 499, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 496.

The antenna module 497 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 401. According to an embodiment, the antenna module497 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., PCB). According to an embodiment, the antenna module 497 mayinclude a plurality of antennas. In such a case, at least one antennaappropriate for a communication scheme used in the communicationnetwork, such as the first network 498 or the second network 499, may beselected, for example, by the communication module 490 (e.g., thewireless communication module 492) from the plurality of antennas. Thesignal or the power may then be transmitted or received between thecommunication module 490 and the external electronic device via theselected at least one antenna. According to an embodiment, anothercomponent (e.g., a radio frequency integrated circuit (RFIC)) other thanthe radiating element may be additionally formed as part of the antennamodule 497.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 401 and the external electronicdevice 404 via the server 408 coupled with the second network 499. Eachof the electronic devices 402 and 404 may be a device of a same type as,or a different type, from the electronic device 401. According to anembodiment, all or some of operations to be executed at the electronicdevice 401 may be executed at one or more of the external electronicdevices 402, 404, or 408. For example, if the electronic device 401should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 401,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 401. The electronic device 401may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, or client-server computingtechnology may be used, for example.

FIG. 5 illustrates a block diagram 500 of an electronic device 401 forsupporting legacy network communication and 5G network communication,according to various embodiments. Referring to FIG. 5, the electronicdevice 401 may include a first communication processor 512, a secondcommunication processor 514, a first radio frequency integrated circuit(RFIC) 522, a second RFIC 524, a third RFIC 526, a fourth RFIC 528, afirst radio frequency front end (REFE) 532, a second REFE 534, a firstantenna module 542, a second antenna module 544, and an antenna 548. Theelectronic device 401 may further include the processor 420 and thememory 430. A second network 499 may include a first cellular network592 and a second cellular network 594. According to another embodiment,the electronic device 401 may further include at least one component ofthe components illustrated in FIG. 4, and the second network 499 mayfurther include at least another network. According to an embodiment,the first communication processor 512, the second communicationprocessor 514, the first RFIC 522, the second RFIC 524, the fourth RFIC528, the first REFE 532, and the second REFE 534 may form at least apart of a wireless communication module 492. According to anotherembodiment, the fourth RFIC 528 may be omitted or may be included as apart of the third RFIC 526.

The first communication processor 512 may establish a communicationchannel for a band to be used for wireless communication with the firstcellular network 592 and may support legacy network communicationthrough the established communication channel. According to variousembodiments, the first cellular network 592 may be a legacy networkincluding a 2^(nd) generation (2G), 3^(rd) generation (3G), 4^(th)generation (4G), or long term evolution (LTE) network. The secondcommunication processor 514 may establish a communication channel for aspecified band (e.g., ranging from about 6 GHz to about 60 GHz) of bandsto be used for wireless communication with the second cellular network594 and may support 5G network communication through the establishedcommunication channel. According to various embodiments, the secondcellular network 594 may be a 5G network defined in the 3GPP.Additionally, according to an embodiment, the first communicationprocessor 512 or the second communication processor 514 may establish acommunication channel for any other specified band (e.g., about 6 GHz orlower) of the bands to be used for wireless communication with thesecond cellular network 594 and may support 5G network communicationthrough the established communication channel. According to anembodiment, the first communication processor 512 and the secondcommunication processor 514 may be implemented in a single chip or asingle package. According to various embodiments, the firstcommunication processor 512 or the second communication processor 514may be implemented in a single chip or a single package together withthe processor 420, the auxiliary processor (e.g., 423 of FIG. 4), or thecommunication module 490.

Upon transmitting a signal, the first RFIC 522 may convert a basebandsignal generated by the first communication processor 512 into a radiofrequency (RF) signal of about 700 MHz to about 3 GHz that is used inthe first cellular network 592. Upon receiving a signal, an RF signalmay be obtained from the first cellular network 592 (e.g., a legacynetwork) through the first antenna module 542 and may be pre-processedthrough an REFE (e.g., the first REFE 532). The first RFIC 522 mayconvert the pre-processed RF signal into a baseband signal so as to beprocessed by the first communication processor 512.

Upon transmitting a signal, the second RFIC 524 may convert a basebandsignal generated by the first communication processor 512 or the secondcommunication processor 514 into an RF signal (hereinafter referred toas a “5G Sub6 RF signal”) in a Sub6 band (e.g., about 6 GHz or lower).Upon receiving a signal, the 5G Sub6 RF signal may be obtained from thesecond cellular network 594 (e.g., a 5G network) through the secondantenna module 544 and may be pre-processed through an REFE (e.g., thesecond REFE 534). The second RFIC 524 may convert the pre-processed 5GSub6 RF signal into a baseband signal so as to be processed by acommunication processor corresponding to the 5G Sub6 RF signal fromamong the first communication processor 512 or the second communicationprocessor 514.

The third RFIC 526 may convert a baseband signal generated by the secondcommunication processor 514 into an RF signal (hereinafter referred toas a “5G Above6 RF signal”) in a 5G Above6 band (e.g., ranging fromabout 6 GHz to about 60 GHz) to be used in the second cellular network594 (e.g., a 5G network). Upon receiving a signal, the 5G Above6 RFsignal may be obtained from the second cellular network 594 (e.g., a 5Gnetwork) through an antenna (e.g., the antenna 548) and may bepre-processed through a third REFE 536. The third RFIC 526 may convertthe pre-processed 5G Above6 RF signal into a baseband signal so as to beprocessed by the second communication processor 514. For example, thethird RFFE 536 may perform a preprocessing of the signal using a phaseshifter 538. According to an embodiment, the third REFE 536 may beimplemented as a part of the third RFIC 526.

According to an embodiment, the electronic device 401 may include thefourth RFIC 528 independently of the third RFIC 526 or as at least apart of the third RFIC 526. In this case, the fourth RFIC 528 mayconvert a baseband signal generated by the second communicationprocessor 514 into an RF signal (intermediate frequency signal,hereinafter referred to as an “IF signal”) in an intermediate frequencyband (e.g., ranging from about 9 GHz to about 11 GHz) and may providethe IF signal to the third RFIC 526. The third RFIC 526 may convert theIF signal into the 5G Above6 RF signal. Upon receiving a signal, the 5GAbove6 RF signal may be received from the second cellular network 594(e.g., a 5G network) through an antenna (e.g., the antenna 548) and maybe converted into an IF signal by the third RFIC 526. The fourth RFIC528 may convert the IF signal into a baseband signal so as to beprocessed by the second communication processor 514.

According to an embodiment, the first RFIC 522 and the second RFIC 524may be implemented with at least a part of a single chip or a singlepackage. According to an embodiment, the first REFE 532 and the secondREFE 534 may be implemented with at least a part of a single chip or asingle package. According to an embodiment, at least one of the firstantenna module 542 or the second antenna module 544 may be omitted ormay be combined with any other antenna module to process RF signals in aplurality of bands.

According to an embodiment, the third RFIC 526 and the antenna 548 maybe disposed at the same substrate to form a third antenna module 546.For example, the wireless communication module 492 or the processor 420may be disposed at a first substrate (e.g., a main PCB). In this case,the third RFIC 526 may be disposed in a partial region (e.g., on a lowersurface) of a second substrate (e.g., a sub PCB) independent of thefirst substrate, the antenna 548 may be disposed in another partialregion (e.g., on an upper surface) of the second substrate, and thus,the third RFIC 526 may be implemented with the third RFIC 526 and theantenna 548. According to an embodiment, the antenna 548 may include,for example, an antenna array to be used for beamforming. As the thirdRFIC 526 and the antenna 548 are disposed at the same substrate, it maybe possible to decrease a length of a transmission line between thethird RFIC 526 and the antenna 548. This may make it possible to reducethe loss (e.g., attenuation) due to the transmission line, with regardto a signal in a high-frequency band (e.g., ranging from about 6 GHz toabout 60 GHz) that is used for the 5G network communication. As such,the electronic device 401 may improve the quality or speed ofcommunication with the second cellular network 594 (e.g., a 5G network).

The second cellular network 594 (e.g., a 5G network) may be usedindependently of the first cellular network 592 (e.g., a legacy network)(e.g., stand-alone (SA)) or may be used in conjunction with the firstcellular network 592 (e.g., non-stand alone (NSA)). For example, only anaccess network (e.g., a 5G radio access network (RAN) or a nextgeneration RAN (NG RAN)) may be present in the 5G network, and a corenetwork (e.g., a next generation core (NGC)) may be absent from the 5Gnetwork. In this case, the electronic device 401 may access the accessnetwork of the 5G network and may then access an external network (e.g.,Internet) under control of the core network (e.g., an evolved packedcore (EPC)) of the legacy network. Protocol information (e.g., LTEprotocol information) for communication with the legacy network orprotocol information (e.g., New Radio (NR) protocol information) forcommunication with the 5G network may be stored in the memory 530 so asto be accessed by any other component (e.g., the processor 520, thefirst communication processor 512, or the second communication processor514).

FIGS. 6A-6C illustrate embodiments of the structure of the third antennamodule 546 of FIG. 5. FIG. 6A illustrates a perspective view of thethird antenna module 546 viewed from one side. FIG. 6B illustrates aperspective view of the third antenna module 546 viewed from the otherside. FIG. 6C illustrates a cross-sectional view of the third antennamodule 546 taken along line A-A′.

Referring to FIGS. 6A-6C, in an embodiment, the third antenna module 546may include a printed circuit board 610, an antenna array 630, an RFIC652, a power manage integrated circuit (PMIC) 654, and a moduleinterface. Selectively, the third antenna module 546 may further includea shielding member 690. In various embodiments, at least one of theabove components may be omitted, or at least two of the components maybe integrally formed.

The printed circuit board 610 may include a plurality of conductivelayers and a plurality of non-conductive layers, and the conductivelayers and the non-conductive layers may be alternately stacked. Theprinted circuit board 610 may provide electrical connection with variouselectronic components, which are disposed on the printed circuit board610 or on the outside, by using wires and conductive vias formed in theconductive layers.

The antenna array 630 (e.g., 548 of FIG. 5) may include a plurality ofantenna elements 632, 634, 636, and 638 disposed to form a directionalbeam. The antenna elements 632, 634, 636, and 638 may be formed on afirst surface of the printed circuit board 610 as illustrated. Accordingto various embodiments, the antenna array 630 may be formed in theprinted circuit board 610. According to embodiments, the antenna array630 may include a plurality of antenna arrays (e.g., a dipole antennaarray and/or a patch antenna array), the shapes or kinds of which areidentical or different.

The RFIC 652 (e.g., third RFIC 526 of FIG. 5) may be disposed on anotherregion (e.g., a second surface opposite to the first surface) of theprinted circuit board 610 so as to be spaced from the antenna array 630.The RFIC 652 may be configured to process a signal in a selectedfrequency band, which is transmitted/received through the antenna array630. According to an embodiment, upon transmitting a signal, the RFIC652 may convert a baseband signal obtained from a communicationprocessor (not illustrated) into an RF signal. Upon receiving a signal,the RFIC 652 may convert an RF signal received through the antenna array630 into a baseband signal and may provide the baseband signal to thecommunication processor.

According to another embodiment, upon transmitting a signal, the RFIC652 may up-convert an IF signal (e.g., about 9 GHz to about 11 GHz)obtained from an intermediate frequency integrated circuit (IFIC) (e.g.,fourth RFIC 528 of FIG. 5) into an RF signal. Upon receiving a signal,the RFIC 652 may down-convert an RF signal obtained through the antennaarray 630 into an IF signal and may provide the IF signal to the IFIC.

The PMIC 654 may be disposed on another region (e.g., the secondsurface) of the printed circuit board 610 so as to be spaced from theantenna array 630. The PMIC 654 may be supplied with a voltage from amain PCB (not illustrated) and may provide a power necessary for variouscomponents (e.g., the RFIC 652) on an antenna module.

The shielding member 690 may be disposed on a portion (e.g., on thesecond surface) of the printed circuit board 610 such that at least oneof the RFIC 652 or the PMIC 654 is electromagnetically shielded.According to an embodiment, the shielding member 690 may include ashield can.

Although not illustrated, in various embodiments, the third antennamodule 546 may be electrically connected with another printed circuitboard (e.g., a main circuit board) through a module interface. Themodule interface may include a connection member, for example, a coaxialcable connector, a board to board connector, an interposer, or aflexible printed circuit board (FPCB). The RFIC 652 and/or the PMIC 654of the third antenna module 546 may be electrically connected with theprinted circuit board 610 through the connection member.

FIG. 7 illustrates a cross section of line B-B′ of a third antennamodule 546 shown in FIG. 6A. The printed circuit board 610 of anembodiment illustrated may include an antenna layer 711 and a networklayer 713.

The antenna layer 711 may include at least one dielectric layer 737-1,and an antenna element 636 and/or a feeding part 725 formed on an outersurface of the dielectric layer 737-1 or therein. The feeding part 725may include a feeding point 727 and/or a feeding line 729.

The network layer 713 may include at least one dielectric layer 737-2;and at least one ground layer 733, at least one conductive via 735, atransmission line 723, and/or the feeding line 729, which are formed onan outer surface of the dielectric layer 737-2 or therein.

In addition, in the embodiment illustrated, the third RFIC 526 of FIG. 5may be electrically connected with the network layer 713, for example,through first and second connection parts (e.g., solder bumps) 740-1 and740-2. In various embodiments, various connection structures (e.g.,soldering or a ball grid array (BGA)). The third RFIC 526 may beelectrically connected with the antenna element 636 through the firstconnection part 740-1, the transmission line 723, and the feeding part725. Also, the third RFIC 526 may be electrically connected with theground layer 733 through the second connection part 740-2 and theconductive via 735. Although not illustrated, the third RFIC 526 mayalso be electrically connected with the above module interface throughthe feeding line 729.

FIG. 8A illustrates an exploded perspective view of the electronicdevice 100 according to an embodiment. FIG. 8B illustrates a side viewof a portion of the electronic device 100 according to an embodiment.

Referring to FIGS. 8A and 8B, the electronic device 100 may include asecond cover 180 forming a second surface (e.g., a surface facing anegative direction of the z axis) of the electronic device 100, a firstside member 140 forming a third surface (e.g., a side surface) of theelectronic device 100, a rear case 160 interposed between the secondcover 180 and the first side member 140, and a second side member 190interposed between the second cover 180 and the first side member 140.

The second cover 180 may include a central portion 181 and an edgeportion 182 surrounding the central portion 181. A camera region 1811that is transparently formed such that a camera included in theelectronic device 100 is viewable through a second surface of theelectronic device 100 may be formed in the central portion 181 of thesecond cover 180. The edge portion 182 of the second cover 180 may bebent toward the second side member 190 with a given curvature.

In various embodiments, the central portion 181 of the second cover 180may be formed in the shape of a flat surface. In an embodiment, thecentral portion 181 of the second cover 180 may be formed in the shapeof a curved surface.

Referring to FIG. 8A, the second cover 180 and the second side member190 may be connected by connecting the edge portion 182 of the secondcover 180 with a third edge portion 1903.

In an embodiment, the second side member 190 may be formed to surroundthe rear case 160. The second side member 190 may include a first edgeportion 1901 where the rear case 160 is disposed, a second edge portion1902 surrounding the first edge portion 1901, and the third edge portion1903 forming the exterior of the electronic device 100.

According to the embodiment illustrated, the rear case 160 may beinterposed between the second cover 180 and the printed circuit board150. A swelling hole may be formed at a plate portion 142 inconsideration of the case where a battery swells when the battery ischarged. The swelling hole may be defined in a region corresponding toat least a portion of the battery.

At least a portion of the first edge portion 1901 and the second edgeportion 1902 of the second side member 190 may be formed in the shape ofa curved surface corresponding to a curved surface of the edge portion182 of the second cover 180.

Referring to FIG. 8A, the third edge portion 1903 may be formed withsubstantially the same curved surface as the curved surface of the edgeportion 182 of the second cover 180 or with substantially the same flatsurface. Alternatively, the third edge portion 1903 may be formed withsubstantially the same curved surface or substantially the same flatsurface as an edge portion 141 of the first side member 140. Forexample, the third edge portion 1903 may be formed with a curved surfacethat is continuous with the edge portion 182 of the second cover 180. Invarious embodiments, the second side member 190 and the first sidemember 140 may be formed of different materials. For example, the firstside member 140 may include a metal material, and the second side member190 may include a polymer material. This is for maintaining theperformance of radiation of an antenna module 200 included in the rearcase 160 that is coupled with or disposed in the second side member 190,which will be more fully described later.

The rear case 160 may include one or more antenna regions where theantenna module 200 is able to be disposed. In this case, the antennaregion may include a recess 161 into which the antenna module 200 isable to be inserted.

In an embodiment, the first side member 140 may include the plateportion 142, in which the printed circuit board 150 and the battery 152are disposed, and the edge portion 141 surrounding the plate portion142.

A display (e.g., the display 130 of FIG. 3) may be disposed in a frontdirection (e.g., a negative direction of the z axis) with respect to theplate portion 142, and the printed circuit board 150 and the rear case160 may be disposed in order in a back direction (e.g., a positivedirection of the z axis) with respect to the plate portion 142.

In an embodiment, the first side member 140 may form a considerableportion of a side surface of the electronic device 100 together with thesecond side member 190. For example, the edge portion 141 of the firstside member 140 may form a considerable portion of an outer surface(e.g., a side surface) of the electronic device 100 together with thethird edge portion 1903 of the second side member 190. The edge portion141 of the first side member 140 may be formed of a different materialfrom the third edge portion 1903 of the second side member 190. Forexample, the edge portion 141 of the first side member 140 may include ametal material, and the third edge portion 1903 of the second sidemember 190 may include a polymer material.

Referring to FIG. 8B, the edge portion 182 of the second cover 180, thethird edge portion 1903 of the second side member 190, the edge portion141 of the first side member 140, and a first cover (not illustrated)(e.g., the front plate 120 of FIG. 3) may form a portion of an outersurface (e.g., a first surface and a third surface) of the electronicdevice 100. The first side member 140 and the second side member 190 maybe formed between the first cover (e.g., the front plate 120 of FIG. 3)and the second cover 180 (e.g., the back plate 180 of FIG. 3).

Referring to FIG. 8B, the first cover 120 may include a transparentregion 1201 where a display (e.g., the display 130 of FIG. 3) is able tobe exposed and an opaque region 1202 (e.g., a bezel region) surroundingat least a portion of the transparent region 1201. In the embodimentillustrated, the opaque region 1202 may be formed in the shape of acurved surface, but the disclosure is not limited thereto. For example,the opaque region 1202 may be formed in the shape of a flat surface.

Referring to FIG. 8B, 801 illustrates a first portion 140 a of the firstside member 140 and a first portion 190 a of the second side member 190,and 802 illustrates a second portion 140 b of the first side member 140and a second portion 190 b of the second side member 190.

Referring to 801 of FIG. 8B, the first portion 140 a of the first sidemember 140 may be thicker than the second portion 140 b in thickness.Referring to 801 of FIG. 8B, the first portion 190 a of the second sidemember 190 may be thicker than the second portion 190 b in thickness.

Referring to 801, the first portion 140 a of the first side member 140may be extended from a first edge 811 where the first portion 140 a ofthe first side member 140 and the first cover 120 are formed, to asecond edge 812 where the first portion 140 a of the first side member140 and the first portion 190 a of the second side member 190 areformed, as much as “L1”.

Referring to 801, the first portion 190 a of the second side member 190may be extended from the second edge 812 to a third edge 813 where thefirst portion 190 a of the second side member 190 and the second cover180 are formed, as much as “L2”.

Likewise, referring to 802, the second portion 140 b of the first sidemember 140 may be extended from a fourth edge 814 where the secondportion 140 b of the first side member 140 and the first cover 120 areformed, to a fifth edge 815 where the second portion 140 b of the firstside member 140 and the second portion 190 b of the second side member190 are formed, as much as “L3”.

Referring to 802, the second portion 190 b of the second side member 190may be extended from the fifth edge 815 to a sixth edge 816 where thesecond portion 190 b of the second side member 190 and the second cover180 are formed, as much as “L4”.

In an embodiment, “L1” may be longer than “L2”. “L3” may be longer than“L4”.

In an embodiment, the first side member 140 may be formed such that thethickness (e.g., L1) of the first portion 140 a is greater than thethickness (e.g., L3) of the second portion 140 b. In an embodiment, thesecond side member 190 may be formed such that the thickness (e.g., L2)of the first portion 190 a is greater than the thickness (e.g., L4) ofthe second portion 190 b.

In the embodiment illustrated in FIG. 8B, the first side member 140forming the third surface of the electronic device 100 may include anedge portion (e.g., the edge portion 141 of FIG. 8A) of the first sidemember 140. The second side member 190 forming the third surface of theelectronic device 100 may include a third edge portion (e.g., the thirdedge portion 1903 of FIG. 8A) of the second side member 190.

FIG. 9A illustrates a perspective view of an antenna module of anelectronic device according to an embodiment. FIG. 9B illustrates aperspective view of the interior of an antenna substrate of an antennamodule illustrated in FIG. 9A, in an embodiment.

Referring to FIGS. 9A and 9B, the antenna module 200 of the electronicdevice 100 according to an embodiment may include an antenna substrate2001, an RFIC module 2002, and a cable 216.

Referring to FIG. 9A, the antenna substrate 2001 may include a firstsurface 211 where a radiation region 2111 for radiating a first RFsignal is formed, a second surface 212 opposite to the first surface211, and a third surface 213 between the first surface 211 and thesecond surface 212. The radiation region 2111 may be formed on the firstsurface 211.

The radiation region 2111 may be formed by a conductive pattern that isformed on the first surface 211 of the antenna substrate 2001, or may beformed by a conductive pattern (e.g., a first antenna element 214) thatis formed in a part of a plurality of layers included in the antennasubstrate 2001 as illustrated in FIG. 9B.

In the embodiment illustrated, the RFIC module 2002 may be disposed onthe second surface 212. In this case, the RFIC module 2002 may includean RFIC (e.g., the third RFIC 526 of FIG. 4), a heat dissipation memberfor cooling heat generated from the RFIC, and a shielding member forblocking an electromagnetic wave. A connector 217 that is coupled withthe cable 216 may be formed on the second surface 212.

Referring to FIG. 9B, the antenna substrate 2001 may include a pluralityof layers. The third surface 213 of the antenna substrate 2001 mayinclude a (3-1)-th surface 2131 where a second antenna element 215 isextended, a (3-2)-th surface 2132 opposite to the (3-1)-th surface 2131,and a (3-3)-th substrate 2133 connecting the (3-1)-th surface 2131 andthe (3-2)-th surface 2132.

The first antenna element 214 and the second antenna element 215 may beformed in the plurality of layers. The first antenna element 214 mayform the radiation region 2111 illustrated in FIG. 9A. In this case, thefirst antenna element 214 may be formed on the first surface 211 of theantenna module 200 or may be formed in a specified region of one or morelayers of the plurality of layers. Here, the specified region may be aregion corresponding to the radiation region 2111 formed on the firstsurface 211 of FIG. 9A.

In an embodiment, the second antenna element 215 may be formed in atleast one layer of the plurality of layers. The second antenna element215 may be extended in a direction facing at least one of the surfaces2131, 2132, and 2133, and the second RF signal may be radiated by thesecond antenna element 215. In various embodiments, the second antennaelement 215 may be formed in the same layer as the first antenna element214.

In an embodiment, a region that is formed by the first antenna element214 for radiating the first RF signal may be referred to as a “firstradiation region” (e.g., the radiation region 2111 of FIG. 9A). Also, aregion that is formed by the second antenna element 215 for radiatingthe second RF signal may be referred to as a “second radiation region”.The second radiation region may include a surface (e.g., the (3-1)-thsurface 2131 of FIG. 9B) that the second antenna element 215 faces, or asurface from which the second RF signal is radiated.

In the embodiment illustrated, the second radiation region, or the(3-1)-th surface 2131 where the second antenna element 215 is extendedmay face direction {circle around (1)}). Here, direction {circle around(1)} may be a direction facing an outer side of a housing structure,which will be described later.

In various embodiments, the second antenna element 215 may include adipole antenna.

In various embodiments, the antenna module 200 may radiate the first RFsignal through the first surface 211 and may radiate the second RFsignal through the (3-1)-th surface 2131.

FIG. 10 illustrates a view of a layout of the antenna module 200 of theelectronic device 100 according to an embodiment.

Referring to FIG. 10, the electronic device 100 may include one or moreantenna modules 310, 320, and 330 disposed at the rear case 160. Theantenna modules 310, 320, and 330 may include the first antenna module310 disposed on the top of a back surface of the electronic device 100illustrated in FIG. 10, the second antenna module 320 disposed on theleft thereof, and the third antenna module 330 disposed on the rightthereof. The antenna modules 310, 320, and 330 may be disposed on asurface facing a back surface of the rear case 160 (e.g., a directionfacing the second cover 180 of FIG. 8A). Here, the antenna modules 310,320, and 330 may be disposed at the rear case 160 such that a firstsurface (e.g., the first surface 211 illustrated in FIGS. 9A and 9B)faces a second surface of an electronic device (e.g., a surface that thesecond cover 180 of FIG. 3 forms).

In various embodiments, the first antenna module 310 may be disposedadjacent to the first portion 140 a of the first side member 140 and/orthe first portion 190 a of the second side member 190. The secondantenna module 320 and the third antenna module 330 may be disposedadjacent to the second portion 140 b of the first side member 140 and/orthe second portion 190 b of the second side member 190.

In an embodiment, a second cover (e.g., the second cover 180 of FIG. 8A)may be disposed on the surface where the antenna modules 310, 320, and330 of the rear case 160 are disposed, so as to cover the antennamodules 310, 320, and 330. A portion of an edge of the rear case 160 maybe covered by the first edge portion 1901 and the second edge portion1902 of the second side member 190, when viewed from the back surface ofthe electronic device 100.

FIG. 11 illustrates a cross-sectional view of the electronic device 100where the first antenna module 310 is disposed, according to anembodiment.

In an embodiment, the electronic device 100 may include the second cover180 forming the second surface (e.g., a back surface) of the electronicdevice 100, the first cover 120 forming the first surface (e.g., a frontsurface) of the electronic device 100, and the first side member 140 andthe second side member 190 forming the third surface (e.g., a sidesurface) of the electronic device 100.

In an embodiment, the electronic device 100 may include an inner spaceformed by the first cover 120, the second cover 180, the first sidemember 140, and the second side member 190. The one or more printedcircuit board 150, the display 130, or the rear case 160 may be disposedin the inner space.

In an embodiment, the display 130 may be disposed below the first cover120 so as to face the first cover 120. The printed circuit board 150 maybe disposed below the display 130 or may be disposed on a surface facingthe first cover 120 of the rear case 160 (e.g., a lower surface withrespect to a drawing). The recess 161 where the first antenna module 310is disposed may be formed at the rear case 160.

In an embodiment, the first antenna module 310 may include a firstsurface 311 (e.g., the first surface 211 of FIG. 9B), a second surface312 on which an RFIC module 3102 (e.g., the RFIC module 2002 of FIG. 9A)is disposed and which is opposite to the first surface 311, and thirdsurfaces 3131 and 3132 (e.g., the third surfaces 2131 and 2132 of FIG.9B) between the first surface 311 and the second surface 312. In thiscase, a first radiation region 3111 (e.g., the first radiation region2111 of FIG. 9B) where the first RF signal is radiated may be formed onthe first surface 311, and a second radiation region (e.g., a (3-1)-thsurface 3131) (e.g., the (3-1)-th surface 2131 of FIG. 9B) where thesecond RF signal is radiated may be formed on at least a part of thethird surfaces 3131 and 3132. The second radiation region may beincluded in the (3-1)-th surface 3131.

In an embodiment, the first antenna module 310 may be disposed in therecess 161 formed at the rear case 160 such that the first radiationregion 3111 faces the second cover 180 and such that the secondradiation region (e.g., the (3-1)-th surface 3131) faces the second sidemember 190. For example, the first antenna module 310 may be disposedsuch that the first surface 311 faces the second cover 180 to make agiven angle with the second cover 180 and such that the (3-1)-th surface3131 faces an outer side of the electronic device 100. For example, thefirst antenna module 310 may be disposed to be inclined at a given anglewith respect to the second cover 180 such that a radiation range (e.g.,a range marked by a dotted line in a drawing) of the second RF signalradiated from the second radiation region formed in the (3-1)-th surface3131 is not covered by the first side member 140.

In various embodiments, the second cover 180 and the first antennamodule 310 may be spaced from each other as much as a given distance. Asit goes from an inner side of the electronic device 100 toward an outerside of the electronic device 100, a distance between the first surface311 of the first antenna module 310 and the second cover 180 maydecrease.

Referring to FIG. 11, a first region, which is adjacent to a surface(e.g., a (3-2)-th surface 3132) opposite to the radiation surface, ofthe first surface 311 of the first antenna module 310 may be spaced fromthe second cover 180 as much as a first distance D1, and a secondregion, which is adjacent to the radiation surface (e.g., the (3-1)-thsurface 3131) where the second RF signal is radiated, of the firstsurface 311 of the first antenna module 310 may be spaced from thesecond cover 180 as much as a second distance D2.

Here, the first distance D1 may be greater than the second distance D2.That is, the radiation surface (e.g., the (3-1)-th surface 3131) may bedisposed to be inclined toward the second cover 180 so as to face aportion of a side member (e.g., the first side member 140 and the secondside member 190) and a portion of the second cover 180. As such, aradiation range of the second RF signal may be determined such that thesecond RF signal passes through the second side member 190 and thesecond cover 180.

In various embodiments, the first antenna module 310 may be disposed atthe rear case 160 such that the first radiation region 3111 faces thesecond surface of the electronic device 100 (e.g., a surface that thesecond cover 180 forms) and such that the second radiation region (e.g.,the (3-1)-th surface 3131) faces the third surface of the electronicdevice 100 (e.g., a surface that the first side member 140 and thesecond side member 190 form).

In the embodiment illustrated, the first antenna module 310 may bedisposed to make a given angle with the second cover 180. In this case,an angle formed by the first antenna module 310 and the second cover 180may be an angle formed by a direction (e.g., a normal vector of thefirst surface 311) that the first surface 311 of the first antennamodule 310 faces and a direction (e.g., a normal vector of the secondcover 180) that the second cover 180 faces. For example, the given anglemay be 0 degree to 15 degrees. In the embodiment illustrated, the firstsurface 311 of the first antenna module 310 may be perpendicularlyconnected with the (3-1)-th surface 3131 where the second radiationregion is formed. Accordingly, the (3-1)-th surface 3131 of the firstantenna module 310 may be disposed to be inclined toward the secondcover 180 as much as a given angle with respect to a direction (e.g.,direction {circle around (1)}) perpendicular to a normal vector of thesecond cover 180.

In various embodiments, the second cover 180 may include a flat portionand a curved portion surrounding the flat portion. In this case, anangle formed by the first antenna module 310 and the second cover 180may be an angle formed by a normal vector of the flat portion of thesecond cover 180 and a normal vector of the first surface 311 of thefirst antenna module 310.

FIGS. 12A, 12B, and 12C are views illustrating the first antenna module310 of the electronic device 100 and the rear case 160 where the firstantenna module 310 is disposed, according to an embodiment.

Referring to FIG. 12A, a protrusion 162 for fixing the first antennamodule 310 may be formed at the recess 161 formed at the rear case 160.

The protrusion 162 may be formed to protrude from an inner surface ofthe recess 161 toward the inside of the recess 161. The protrusion 162may press the first surface 311 of the first antenna module 310, thuspreventing the first antenna module 310 from being detached toward thesecond cover 180.

Referring to FIG. 12B, a surface, which faces the second surface 312 ofthe first antenna module 310, of an inner surface of the recess 161 maybe implemented with an inclined surface 164 having an anglecorresponding to a placement angle of the first antenna module 310. Anadditional recess 165 into which the RFIC module 3102 disposed on thesecond surface 312 of the first antenna module 310 is able to beinserted may be formed at the inclined surface 164.

In various embodiments, the second surface 312 of the first antennamodule 310 may be supported by the inclined surface 164 of the recess161, and the first antenna module 310 may be pressed and fitted in therecess 161 by the protrusion 162 formed on the inner surface of therecess 161.

Referring to FIG. 12C, in various embodiments, the electronic device 100may include a cover member 166 covering the first antenna module 310 forthe purpose of fixing the first antenna module 310 in the recess 161 ofthe rear case 160. The cover member 166 may be formed of a nonmetalmaterial and may not have an influence on the first RF signal radiatedfrom the first surface 311. The cover member 166 may be fixed in therecess 161 by the second cover 180 or may have a separate component forfixing.

The first antenna module 310 may include an antenna substrate 3101including the first surface 311 and the second surface 312, the RFICmodule 3102 disposed on the second surface 312 of the antenna substrate3101, a connector 317 formed on the second surface 312 of the antennasubstrate 3101, and a flexible printed circuit board (FPCB) 316connected with the connector 317. In the embodiment illustrated, theRFIC module 3102 may be disposed on the inclined surface 164. Theconnector 317 formed at the antenna substrate 3101 may further protrudetoward the inclined surface 164 compared with the RFIC module 3102.Accordingly, the additional recess 165 for accommodating a portion ofthe connector 317 and the FPCB 316 may be formed in the recess 161 wherethe first antenna module 310 is accommodated. The additional recess 165may be formed at the inclined surface 164.

FIG. 13A illustrates a cross-sectional view of the electronic device 100where the second antenna module 320 is disposed, according to anembodiment. FIG. 13B illustrates a cross-sectional view of theelectronic device 100 where the third antenna module 330 is disposed,according to an embodiment.

Referring to FIG. 13A, the second antenna module 320 may be disposed onopposite sides (e.g., opposite ends of the x-axis direction of FIG. 8B)of the rear case 160.

The electronic device 100 according to the embodiment illustrated mayinclude the first cover 120, the second cover 180 that is opposite tothe first cover 120, the first side member 140 that is connected withthe first cover 120 and includes the edge portion 141 forming a portionof an outer surface (e.g., a side surface) of the electronic device 100and the plate portion 142 extended from the edge portion 141 between thefirst cover 120 and the second cover 180, and the second side member 190that connects the second cover 180 and the first side member 140 andforms a portion of the rest of the outer surface (e.g., a side surface)of the electronic device 100.

In various embodiments, the electronic device 100 may further includethe printed circuit board 150 that is interposed between the plateportion 142 of the first side member 140 and the second cover 180, therear case 160 that is interposed between the printed circuit board 150and the second cover 180, and the display 130 that is disposed in adirection facing away from the printed circuit board 150 with respect tothe plate portion 142 (e.g., is disposed on a surface of the rear case160, which faces the first cover 120).

In an embodiment, the electronic device 100 may include a housing (e.g.,the housing 110 of FIG. 1) that includes the first cover 120, the secondcover 180, and the first side member 140 surrounding a space between thefirst cover 120 and the second cover 180; and the display 130, theprinted circuit board 150, and the rear case 160 may be arranged in thehousing in order in a direction that faces the second cover 180 from thefirst cover 120.

According to the embodiment illustrated, the second antenna module 320may be disposed at the rear case 160. The second antenna module 320 mayinclude an antenna substrate 3201 that includes a first surface 321(e.g., the first surface 211 of FIG. 9B), a second surface 322 on whichan RFIC module 3202 (e.g., the RFIC module 2002 of FIG. 9A) is disposedand which is opposite to the first surface 321, and third surfaces 3231and 3232 (e.g., the surfaces 2131 and 2132 of FIG. 9B) between the firstsurface 321 and the second surface 322, and the RFIC module 3202disposed on the second surface 322.

In this case, a first radiation region 3211 (e.g., the first radiationregion 2111 of FIG. 9B) where the first RF signal is radiated may beformed on the first surface 321 of the antenna substrate 3201, and asecond radiation region (e.g., the (3-1)-th surface 2131 of FIG. 9B)where the second RF signal is radiated may be formed on at least a part(e.g., a (3-1)-th surface 3231) of the third surfaces 3231 and 3232.

In an embodiment, the second antenna module 320 may be disposed at therear case 160 such that the first radiation region 3211 faces the secondcover 180 and such that the (3-1)-th surface 3231 faces the second sidemember 190. In an embodiment, unlike a first antenna module (e.g., thefirst antenna module 310 of FIG. 11), the second antenna module 320 maybe disposed parallel to the second cover 180 (e.g., the second cover 180of FIG. 11).

Referring to FIG. 13B, the third antenna module 330 may be disposed onopposite sides (e.g., opposite ends of the x-axis direction of FIG. 8B)of the rear case 160.

According to the embodiment illustrated, the third antenna module 330may be disposed at the rear case 160. The third antenna module 330 mayinclude an antenna substrate 3301 that includes a first surface 331(e.g., the first surface 211 of FIG. 9B), a second surface 332 that isopposite to the first surface 331, and third surfaces 3331 and 3332(e.g., the surfaces 2131 and 2132 of FIG. 9B) between the first surface331 and the second surface 332, and an RFIC module 3302 (e.g., the RFICmodule 2002 of FIG. 9A) disposed on the second surface 332.

In this case, a first radiation region 3311 (e.g., the first radiationregion 2111 of FIG. 9B) where the first RF signal is radiated may beformed on the first surface 331 of the antenna substrate 3301, and asecond radiation region (e.g., the (3-1)-th surface 2131 of FIG. 9B)where the second RF signal is radiated may be formed on at least a part(e.g., a (3-1)-th surface 3331) of the third surfaces 3331 and 3332.

In an embodiment, the third antenna module 330 may be disposed at therear case 160 such that the first radiation region 3311 faces the secondcover 180 and such that the (3-1)-th surface 3331 where the secondradiation region is formed faces the second side member 190. In anembodiment, unlike a first antenna module (e.g., the first antennamodule 310 of FIG. 11), the third antenna module 330 may be disposedparallel to the second cover 180 (e.g., the second cover 180 of FIG.11).

In various embodiments, the second antenna module 320 illustrated inFIG. 13A and the third antenna module 330 illustrated in FIG. 13B areillustrated as being disposed parallel to the second cover 180, but thedisclosure is not limited thereto. For example, the second antennamodule 320 and/or the third antenna module 330 may be disposed to beinclined so as to make a given angle with the second cover 180. Here,the given angle may be smaller than an angle that is formed by a firstantenna module (e.g., the first antenna module 310 of FIG. 11) and thesecond cover 180.

Referring to FIGS. 11, 13A, and 13B, placement angles of a first antennamodule (e.g., the first antenna module 310 of FIG. 11), a second antennamodule (e.g., the second antenna module 320 of FIG. 13A), and a thirdantenna module (e.g., the third antenna module 330 of FIG. 13B)described in the disclosure may vary depending on a material ofstructures forming the exterior of the electronic device 100 or ahousing. For example, the placement angle may be determined depending ona material of housing structures included in a range where an RF signal(e.g., a signal radiated from a dipole antenna) is radiated.

For example, in the case where side members (e.g., the first side member140 and the second side member 190) forming a side surface of theelectronic device 100 or a housing are formed of only a material (e.g.,a ceramic or polymer) having no influence on radiation of radio waves,the first surfaces 311, 321, and 331 of the antenna substrates 3101,3201, and 330 respectively included in the first, second, and thirdantenna modules 310, 320, and 330 may be disposed parallel to the secondcover 180. That is, second radiation regions (e.g., the (3-1)-thsurfaces 3131, 3231, and 3331) where the second RF signals are radiatedmay be disposed to face the side members (e.g., the first side member140 and the second side member 190).

For example, in the case where a part of side members (e.g., the firstside member 140 and the second side member 190) forming the side surfaceof the electronic device 100 or the housing is formed of a material(e.g., a metal) having an influence on radiation of radio waves and therest thereof includes a material (e.g., a ceramic or polymer) having noinfluence on the radiation of radio waves (e.g., the first side member140 is formed of a metal and the second side member 190 is formed ofpolycarbonate), the first, second, and third antenna modules 310, 320,and 330 may be disposed such that the first surfaces 311, 321, and 331of the antenna substrates 3101, 3201, and 330 respectively includedtherein make a given angle with the second cover 180. That is, thesecond radiation regions (e.g., the (3-1)-th surfaces 3131, 3231, and3331) where the second RF signals are radiated may be disposed to face apart, which includes a material having no influence on the radiation ofradio waves, from among the side members 140 and 190 (e.g., to face thesecond side member 190 formed of polycarbonate). The antenna modules310, 320, and 330 may be disposed such that a metal material or astructure (e.g., the first side member 140) formed of a metal materialis not included in the radiation range of the second RF signal.

In various embodiments, the electronic device 100 may include a housingthat includes the front plate 120 facing a first direction, the backplate 180 facing a second direction opposite to the first direction, anda side member (e.g., including the first support member 140 and thesecond side member 190) surrounding a space between the front plate 120and the back plate 180 and at least a portion of which is formed of ametal material, the display 130 that is viewable through the front plate120, and an antenna module (e.g., the first antenna module 310 of FIG.11) that is positioned in the space and includes the first surface 311facing a third direction different from the first direction and thesecond direction, the second surface 312 facing a fourth directiondifferent from the third direction, and at least one conductive element(e.g., the second antenna element 315 of FIG. 12A) extended in a fifthdirection facing a first portion (e.g., the second side member 190 ofFIG. 11) of the side member (140, 190). The at least one conductiveelement may be adjacent to the side member (140, 190) and may be betweenthe first surface 311 and the second surface 312, and the fifthdirection may be perpendicular to the third direction and the fourthdirection. The first surface may include a first periphery (e.g., aportion where D2 of FIG. 12 is illustrated) the closest from the firstportion of the side member, and a second periphery (e.g., a portionwhere D1 of FIG. 12 is illustrated) the most distant from the firstportion 190 of the side member (140, 190), and the first surface 311 maymake an angle between 1 degree to 15 degrees with the back plate 180such that the first periphery is closer to the back plate 180 than thesecond periphery.

In various embodiments, the electronic device 100 may further include awireless communication circuit (e.g., the RFIC module 3102 of FIG. 11)that transmits and/or receives a signal having a frequency between 20GHz and 100 GHz, and the conductive element (e.g., the second antennaelement 315 of FIG. 12A) may be electrically connected with the wirelesscommunication circuit 3102.

In various embodiments, the conductive element 315 may form a dipoleantenna.

In various embodiments, the back plate 180 may further include an edgeportion that is adjacent to the first portion 190 of the side member(140, 190) and forms a bent surface.

In various embodiments, the first portion 190 of the side member (140,190) may include a non-conductive material.

In various embodiments, the electronic device 100 may further include amid plate (e.g., the rear case 160 of FIG. 11 or the first supportmember 142 of FIG. 3) interposed between the display 130 and the backplate 180, the antenna module 310 may be interposed between the midplate 160 and the back plate 180.

In various embodiments, the mid plate 160 may include a first surfacefacing the first direction and the display 130, and a second surfaceopposite to the first surface and on which the antenna module 310 isdisposed, a recess 161 where the antenna modules 310 is disposed isformed in the second surface of the mid plate 160, and the recess 161may include an inclined surface 164 on which the second surface 312 ofthe antenna module 310 is disposed and having an angle corresponding toan angle formed by the back plate 180 and the first surface 311 of theantenna module 310.

In various embodiments, the side member (140, 190) may form a sidesurface of the electronic device 100 between the front plate 120 and theback plate 180 and may include a short side portion (e.g., the shortside portion 140 a of FIG. 10) having a first length and a long sideportion (e.g., a long side portion 140 b of FIG. 10) having a secondlength longer than the first length, the short side portion 140 a may beformed from the front plate 120 to the back plate 180 with a firstheight, and the long side portion 140 b may be formed from the frontplate 120 to the back plate 180 with a second height greater than thefirst height.

In various embodiments, the antenna module (e.g., including the firstantenna module 310, the second antenna module 320, and the third antennamodule 330) may include a first antenna module (e.g., the first antennamodule 310) disposed adjacent to the short side portion 140 a and asecond antenna module (e.g., the second antenna module 320 and the thirdantenna module 330) disposed adjacent to the long side portion 140 b,and an angle formed by the first surface 311 of the first antenna module310 and the back plate 180 may be greater than an angle formed by thefirst surface (321, 331) of the second antenna module (320, 330) and theback plate 180.

In various embodiments, the electronic device 100 may include a housingthat includes the front plate 120 facing a first direction, the backplate 180 including a flat portion facing a second direction opposite tothe first direction and a curved portion surrounding the flat portion,and a side member (e.g., including the first support member 140 and thesecond support member 190 of FIG. 11) surrounding a space between thefront plate 120 and the back plate 180 and at least a portion of whichis formed of a metal material, the display 130 that is viewable throughthe front plate 120, and the antenna module 310 that is positioned inthe space and includes the first surface 311 facing a third directiondifferent from the first direction and the second direction, the secondsurface 312 facing a fourth direction different from the thirddirection, and at least one or more conductive elements (e.g., thesecond antenna module 315 of FIG. 12A) extended in a fifth directionfacing a first portion (e.g., the second side member 190) of the sidemember (140, 190). The at least one or more conductive elements (e.g.,the second antenna module 315 of FIG. 12A) may be adjacent to the sidemember (140, 190) and may be between the first surface 311 and thesecond surface 312, and the fifth direction may be perpendicular to thethird direction and the fourth direction. The first surface 311 mayinclude a first periphery being closest from the first portion 190 ofthe side member (140, 190), and a second periphery being most distantfrom the first portion 190 of the side member (140, 190), and the firstperiphery may be disposed to be closer to the back plate 180 than thesecond periphery.

In various embodiments, the side member (140, 190) may include the shortside portion 140 a having a first length and the long side portion 140 bhaving a second length longer than the first length and may form a sidesurface of the electronic device 100 between the front plate 120 and theback plate 180, and the side member (140, 190) may include a metalportion (e.g., the first support member 140 of FIG. 11) formed of ametal material and a nonmetal portion (e.g., the second side member 190of FIG. 11) formed of a nonmetal material. When viewed from above thefront plate 120 of the electronic device 100, the nonmetal portion 190included in the short side portion 140 a may be viewed to be wider thanthe nonmetal portion 190 included in the long side portion 140 b.

In various embodiments, the side member (140, 190) may include the shortside portion 140 a having a first length and the long side portion 140 bhaving a second length longer than the first length, the first portion190 may be connected with the curved portion of the back plate 180, andthe curved portion connected with the first portion 190 included in theshort side portion 140 a may have a curvature smaller than the curvedportion connected with the first portion 190 included in the long sideportion 140 b.

In various embodiments, an electronic device may include a housingstructure that includes a first cover (e.g., the front plate 120)forming a first surface of the electronic device, a second cover (e.g.,the back plate 180) forming a second surface of the electronic device,which is opposite to the first surface, and a side member (140, 190)surrounding a space between the first cover (e.g., the front plate 120)and the second cover (e.g., the back plate 180) and forming a thirdsurface of the electronic device, the display 130 that is interposedbetween the first cover (e.g., the front plate 120) and the second cover(e.g., the back plate 180), and the antenna module 310 that isinterposed between the display 130 and the second cover (e.g., the backplate 180) and includes the first surface 311 including the firstradiation region 3111 where a first RF signal is radiated, the secondsurface 312 opposite to the first surface 311, the third surface 3131formed between the first surface 311 and the second surface 312 andincluding a second radiation region where a second RF signal isradiated, and the fourth surface 3132 formed between the first surface311 and the second surface 312 and opposite to the third surface 3131.The antenna module 310 may be disposed to be inclined at a given anglewith respect to the second cover (e.g., the back plate 180) such thatthe first surface 311 faces the second cover (e.g., the back plate 180),the third surface 3131 is more adjacent to the side member (140, 190)than the fourth surface 3132, and at least a portion of the secondradiation region faces the second cover (e.g., the back plate 180).

In various embodiments, the side member (140, 190) may include a firstportion (e.g., the first side member 140) and a second portion (e.g.,the second side member 190), and the first portion may include a metalmaterial and the second portion may include a non-conductive material.

In various embodiments, at least a portion of the third surface 3131 ofthe antenna module 310 may face the second portion (e.g., the secondside member 190).

In various embodiments, the antenna module 310 may be disposed to beinclined, such that a radiation range of the second RF signal furtherincludes the second portion (e.g., the second side member 190) of theside member (140, 190) compared with the first portion (e.g., the firstside member 140) of the side member (140, 190).

In various embodiments, the first surface 311 of the antenna module 310may include a first region adjacent to the third surface 3131 of theantenna module 310 and a second region adjacent to the fourth surface3132 of the antenna module 310, and a first distance between the firstregion and the second cover (e.g., the back plate 180) may be smallerthan a second distance between the second region and the second cover(e.g., the back plate 180).

In various embodiments, a radio frequency integrated circuit (RFIC)module may be disposed on the second surface 312 of the antenna module310.

In various embodiments, the first surface 311 of the antenna module 310may be perpendicular to the third surface 3131 of the antenna module310.

In various embodiments, the side member (140, 190) may include a firststructure (e.g., the edge portion 141) forming a side surface of theelectronic device and a second structure (e.g., the plate portion 142)extended into an inside of the housing structure from the firststructure, the electronic device may further include the rear case 160that is interposed between the second structure and the second cover,and the antenna module 310 may be disposed at the rear case 160.

In various embodiments, the recess 161 into which the antenna module 310is inserted may be formed at the rear case 160, the recess 161 mayinclude an inclined surface 164 on which the second surface 312 of theantenna module 310 is disposed, and the protrusion 162 that protrudesfrom an inner surface of the recess 161 so as to press a portion of anedge of the first surface 311 of the antenna module 310.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the presentdisclosure and the terms used therein are not intended to limit thetechnological features set forth herein to particular embodiments andinclude various changes, equivalents, or replacements for acorresponding embodiment. With regard to the description of thedrawings, similar reference numerals may be used to refer to similar orrelated elements. It is to be understood that a singular form of a nouncorresponding to an item may include one or more of the things, unlessthe relevant context clearly indicates otherwise. As used herein, eachof such phrases as “A or B,” “at least one of A and B,” “at least one ofA or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least oneof A, B, or C,” may include any one of, or all possible combinations ofthe items enumerated together in a corresponding one of the phrases. Asused herein, such terms as “1st” and “2nd,” or “first” and “second” maybe used to simply distinguish a corresponding component from another,and does not limit the components in other aspect (e.g., importance ororder). It is to be understood that if an element (e.g., a firstelement) is referred to, with or without the term “operatively” or“communicatively”, as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), it means thatthe element may be coupled with the other element directly (e.g.,wiredly), wirelessly, or via a third element.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, and may interchangeably be used withother terms, for example, “logic,” “logic block,” “part,” or“circuitry”. A module may be a single integral component, or a minimumunit or part thereof, adapted to perform one or more functions. Forexample, according to an embodiment, the module may be implemented in aform of an application-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 440) including one or more instructions that arestored in a storage medium (e.g., internal memory 436 or external memory438) that is readable by a machine (e.g., the electronic device 401).For example, a processor(e.g., the processor 420) of the machine (e.g.,the electronic device 401) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the term “non-transitory” simply means that the storage medium is atangible device, and does not include a signal (e.g., an electromagneticwave), but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities. According to various embodiments, one or more ofthe above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to various embodiments, operations performedby the module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

According to embodiments of the disclosure, in an electronic deviceincluding a housing and an antenna module included in the housing, anantenna module layout structure capable of minimizing the influence of ametal component of the housing on an RF signal and an electronic deviceincluding the same may be provided.

Besides, a variety of effects directly or indirectly understood throughthis disclosure may be provided.

Although the present disclosure has been described with variousembodiments, various changes and modifications may be suggested to oneskilled in the art. It is intended that the present disclosure encompasssuch changes and modifications as fall within the scope of the appendedclaims.

What is claimed is:
 1. An electronic device comprising: a housingincluding a front plate facing a first direction, a back plate facing asecond direction opposite to the first direction, and a side membersurrounding a space between the front plate and the back plate and atleast a portion of which is formed of a metal material; a displayviewable through the front plate; and an antenna module positioned inthe space, and wherein the antenna module includes: a first surfacefacing a third direction different from the first direction and thesecond direction; a second surface facing a fourth direction differentfrom the third direction; and at least one conductive element extendedin a fifth direction facing a first portion of the side member, the atleast one conductive element being adjacent to the side member and beingbetween the first surface and the second surface, and the fifthdirection being perpendicular to the third direction and the fourthdirection, wherein the first surface includes: a first periphery beingclosest from the first portion of the side member; and a secondperiphery being most distant from the first portion of the side member,and wherein the first periphery is closer to the back plate than thesecond periphery.
 2. The electronic device of claim 1, furthercomprising: a wireless communication circuit configured to transmitand/or receive a signal having a frequency between 20 GHz and 100 GHz,wherein the conductive element is electrically connected with thewireless communication circuit.
 3. The electronic device of claim 1,wherein the conductive element forms a dipole antenna.
 4. The electronicdevice of claim 1, wherein the first surface makes an angle between 1degree to 15 degrees with the back plate such that the first peripheryis closer to the back plate than the second periphery.
 5. The electronicdevice of claim 1, wherein the first portion of the side member includesa non-conductive material.
 6. The electronic device of claim 1, furthercomprising: a mid plate interposed between the display and the backplate, wherein the antenna module is interposed between the mid plateand the back plate.
 7. The electronic device of claim 6, wherein: themid plate includes a first surface facing the first direction and thedisplay, and a second surface opposite to the first surface and on whichthe antenna module is disposed; and a recess where the antenna module isdisposed is formed in the second surface of the mid plate, wherein therecess includes: an inclined surface on which the second surface of theantenna module is disposed and having an angle corresponding to an angleformed by the back plate and the first surface of the antenna module. 8.The electronic device of claim 1, wherein: the side member forms a sidesurface of the electronic device between the front plate and the backplate and includes a short side portion having a first length and a longside portion having a second length longer than the first length; theshort side portion is formed from the front plate to the back plate witha first height; and the long side portion is formed from the front plateto the back plate with a second height greater than the first height. 9.The electronic device of claim 8, wherein: the antenna module includes afirst antenna module disposed adjacent to the short side portion and asecond antenna module disposed adjacent to the long side portion; and anangle formed by the first surface of the first antenna module and theback plate is greater than an angle formed by the first surface of thesecond antenna module and the back plate.
 10. An electronic devicecomprising: a housing including a front plate facing a first direction,a back plate including a flat portion facing a second direction oppositeto the first direction and a curved portion surrounding the flatportion, and a side member surrounding a space between the front plateand the back plate and at least a portion of which is formed of a metalmaterial; a display viewable through the front plate; and an antennamodule positioned in the space, and wherein antenna module includes: afirst surface facing a third direction different from the firstdirection and the second direction; a second surface facing a fourthdirection different from the third direction; and at least one or moreconductive elements extended in a fifth direction facing a first portionof the side member, the at least one or more conductive elements beingadjacent to the side member and being between the first surface and thesecond surface, and the fifth direction being perpendicular to the thirddirection and the fourth direction, wherein the first surface includes:a first periphery being closest from the first portion of the sidemember; and a second periphery being most distant from the first portionof the side member, and wherein the first periphery is disposed to becloser to the back plate than the second periphery.
 11. The electronicdevice of claim 10, wherein: the side member includes a short sideportion having a first length and a long side portion having a secondlength longer than the first length and forms a side surface of theelectronic device between the front plate and the back plate; the sidemember includes a metal portion formed of a metal material and anonmetal portion formed of a nonmetal material; and when viewed fromabove the front plate of the electronic device, the nonmetal portionincluded in the short side portion is viewed to be wider than thenonmetal portion included in the long side portion.
 12. The electronicdevice of claim 10, wherein: the side member includes a short sideportion having a first length and a long side portion having a secondlength longer than the first length; the side member includes a metalportion formed of a metal material and a nonmetal portion formed of anonmetal material; the nonmetal portion is connected with the curvedportion of the back plate; and the curved portion connected with thenonmetal portion included in the short side portion has a curvaturesmaller than the curved portion connected with the nonmetal portionincluded in the long side portion.
 13. An electronic device comprising:a housing structure including a first cover forming a first surface ofthe electronic device, a second cover forming a second surface of theelectronic device, which is opposite to the first surface, and a sidemember surrounding a space between the first cover and the second coverand forming a third surface of the electronic device; a displayinterposed between the first cover and the second cover; and an antennamodule interposed between the display and the second cover, andincluding a first surface including a first radiation region where afirst radio frequency (RF) signal is radiated, a second surface oppositeto the first surface, a third surface formed between the first surfaceand the second surface and including a second radiation region where asecond RF signal is radiated, and a fourth surface formed between thefirst surface and the second surface and opposite to the third surface,wherein the antenna module is disposed to be inclined at a given anglewith respect to the second cover such that the first surface faces thesecond cover, the third surface is more adjacent to the side member thanthe fourth surface, and at least a portion of the second radiationregion faces the second cover.
 14. The electronic device of claim 13,wherein: the side member includes a first portion and a second portion;the first portion includes a metal material and the second portionincludes a non-conductive material; and at least a portion of the thirdsurface of the antenna module is disposed to face the second portion.15. The electronic device of claim 14, wherein the antenna module isdisposed to be inclined, such that a radiation range of the second RFsignal further includes the second portion of the side member comparedwith the first portion of the side member.
 16. The electronic device ofclaim 13, wherein: the first surface of the antenna module includes afirst region adjacent to the third surface of the antenna module and asecond region adjacent to the fourth surface of the antenna module; anda first distance between the first region and the second cover issmaller than a second distance between the second region and the secondcover.
 17. The electronic device of claim 13, wherein a radio frequencyintegrated circuit (RFIC) module is disposed on the second surface ofthe antenna module.
 18. The electronic device of claim 13, wherein thefirst surface of the antenna module is perpendicular to the thirdsurface of the antenna module.
 19. The electronic device of claim 13,wherein the side member includes a first structure forming a sidesurface of the electronic device and a second structure extended into aninside of the housing structure from the first structure, and whereinthe electronic device further comprises: a rear case interposed betweenthe second structure and the second cover, and wherein the antennamodule is disposed at the rear case.
 20. The electronic device of claim19, wherein a recess into which the antenna module is inserted is formedat the rear case, wherein the recess includes: an inclined surface onwhich the second surface of the antenna module is disposed; and aprotrusion protruding from an inner surface of the recess so as to pressa portion of an edge of the first surface of the antenna module.